Hewlett Packard tasked the 2006 Global Clinic team with determining the feasibility of developing computational fluid dynamic (CFD) models of flows associated with an innovative roll-to-roll transistor production process. To aid optimization of the roll-to-roll process, simulations of coating and imprinting processes using Flow3D, a commercially available CFD modeling package, are desired. These models will facilitate stamp design for the imprinting process and assist in determining feasible throughput conditions for large-scale production.