Solderability of Lead-Free Components in Standard Soldering Processes
January 1, 2007Northrop Grumman Engineering, 2006-07
Liaison(s): Randy Bremner, Lonnie Logan, Chandra Sharma, Evan Sworzyn, William Vanier
Advisor(s): Ziyad Durón ’81
Students(s): Monica Ascarrunz (S), Mark Emanuel, Tracy Fox, Bart Oegema (TL), Seung Yoo (F)
The Northrop Grumman Clinic team analyzed and compared the relative performances of different solder pastes when used to solder pure tin plated components with standard soldering methods. Mechanical testing was done to determine relative solder joint strengths, and metallography was used to examine metal interactions and solder joint quality. The study also included components that were steam aged to three different profiles to determine the effects of aging on solderability.