Lead-free solder is becoming prominent in a variety of industries and awareness is increasing from the environmental engineering trends. The Northrop Grumman Clinic Team examined and compared the reliability of lead-free solder with traditional leaded solder. Life-time reliability of components was evaluated by using accelerated thermal cycling to simulate several years of the products life cycle, vibration and shock testing were also completed. Examination via imaging of the solder joints allowed for further analysis.