Develop mathematical models that can be used to characterize the viscoelastic isolation mounts on Orthodyne Electronics’ 3600Plus ultrasonic wire bonder. The models are constructed using experimental force and displacement data, and they predict the transient settling behavior of the isolation mounts for a bandwidth limited set of forcing frequencies. Construct an experimental setup that represents a simplified version of the wire bonder. Validate the models by comparing the experimental transient displacement of the setup with the predicted response for each model.