Rapid Silicon Wafer Temperature Conditioner
January 1, 2012KLA-Tencor Corporation Engineering, 2011-12
Liaison(s): Steve Cui PhD, Anoop George PhD
Advisor(s): Adrian Hightower
Students(s): Kirby Haraguchi (TL-S), Dalar Nazarian (TL-F), Niger Washington, Kevin Tham, Tiffany Liu (S), Matthew Kweon (F)
The KLA-Tencor Clinic Team was tasked to de-sign, build and test a rapid silicon wafer temperature conditioner (RSWTC) for use in KLA-Tencor’s current geometry inspection process. The goal of the RSWTC is to decrease error in geometry measurement caused by temperature variation between wafers when inspecting the dimensions and characteristics of silicon wafers. The RSWTC must take in a wafer, near room temperature, and heat it to a user specified temperature, without physically contacting the wafer, within 10 seconds.